Process	Products	Characteristic
Desmear	MLB-496/MLB-497/MLB-790M	Remove smear of multilayer board
	MLB-495/MLB-497/MLB-790M	Roughening laminate surfaces for build-up
	MLB-6001/MLB-497/MLB-790M	Remove smear of through hole and blind-via-hole
Glass Etch	MLB Glass Etch Additive M	Remove glass fiber of through hole and blind-via-hole

Process	Products	Characteristic
Cleaner Conditioner	Melplate PC-6160	Outstanding conditioning of glass fiber surface
Soft Etching	Enplate E-462	H2O2-H2SO4 Type
	Melplate AD-331	Compatible with horizontal transfer equipment
Pre dip	Enplate PC-236	Pre-dip bath for activator
Activator	Enplate Activator 444	Low HCl concentration type   Can be used in pre-treatment for PTH and BVH plating
	Enplate PC-236
Accelator	Melplate PA-360	Non-fluoride type
Electroless copper plating	Melplate CU-390	Good coverage in through hole and blind-via-hole

Process	Products	Characteristic
Acid copper plating	Copper Gleam HVS-202	Excellent throwing power and via filling performance   (Insoluble type)
	Copper Gleam HVS-202N	Excellent throwing power and via filling performance   (Soluble type)
	Copper Gleam HS-200	Acid copper plating for insoluble anode (High C.D.)
	Copper Gleam HS-201	Acid copper plating for insoluble anode
	Copper Gleam ST-901	Excellent throwing power at high current density
	Copper Gleam CG-125	Excellent throwing power at high current density
	Copper Gleam CLX	Suitable for flexible circuit due to low internal stress
	Copper Gleam HGX	Excellent bright rolled copper and electrolytic copper   (Suitable for FPC)
	Copper Gleam PPR	Acid copper plating for pulse current
	Copper Gleam PPR-H	Horizontal type acid copper plating for pulse current
	MicroFill TM EVF	Excellent via filling performance (Insoluble type)
	MicroFill TM EVF-S	Excellent via filling performance (Soluble type)
Acid tin plating	Ronastan EC-1	Additives for sulfuric acid based tin plating for etching resist
Nickel / Gold plating	Nikal PC-3	Brightener of nickel plating for PWB and electrical parts
	Ronovel C	High-speed hard gold plating for connector and PWB

ENIG

Process	Products	Characteristic
Cleaner	Melplate PC-6122	Excellent for removal of resist residue
Soft Etching	Melplate AD-331	Etching speed is almost constant
Acid Dipping	H2SO4	Oxidation prevent
Catalyst	Melplate Activator-352	Hydrochloric acid type (Compatible with fine patterns)
	Melplate Activator-354	Sulfuric acid type (Compatible with fine patterns)
Electroless Nickel Plating	Melplate NI-6509MF	Medium phosphorus bath for SMT and BGA board   (Heavy metal free)
	Melplate NI-6575	Partial EN/IG compatible (Medium phosphorus bath)
Immersion Gold Plating	Melplate AU-6601M	Excellent wire bondability and solder ball joint strength   (Cyanide type)
	Melplate AU-6630	Excellent wire bondability and solder ball joint strength   (Cyanide type)

ENEPIG

Process	Products	Characteristic
Cleaner	Melplate PC-6122	Excellent for removal of resist residue
Soft Etching	Melplate AD-331	Etching speed is almost constant
Acid Dipping	H2SO4	Oxidation prevent
Predip	Melplate Acitvator-354-2M	Pre dip
Activator	Melplate Activator-354	Sulfuric acid type (Compatible with fine patterns)
Electroless Ni Plating	Melplate NI-6502	Excellent of corrosion resistance
Electroless Pd Plating	Melplate Pal-6700	Excellent wire bondability and solder ball joint strength
Immersion Au Plating	Melplate AU-6601M	Excellent wire bondability and solder ball joint strength   (Cyanide type)

Application	Products	Characteristic
Alkaline cleaner	Melplate PC-1140	Effectively removes fingerprint, light oxide
Acidic cleaner	Melplate PC-6122	Can remove photoresist residue
Acidic cleaner	Melplate PC-316	A halogen-free cleaner that effectively prevents pits on   pattern plating
Acidic cleaner	Melplate PC-6140	Acidic cleaner for mild etching

Products	Materials	Characteristic
Entek Cu-56	Copper / Copper alloy	Contains methanol
Entek Cu-560	Copper / Copper alloy	Not contains methanol(Lower COD)
Meldip AG-6801	Silver	Prevent deterioration of solder wettability

Application	Products	Characteristic
Resist stripper	Melstrip DF-3820	Optimal for fine patterns due to its fast stripping and   miniaturization of peeling fragments of dry film resist
	Melstrip DF-3850	Optimal for fine patterns due to its fast stripping and   miniaturization of peeling fragments of dry film resist
	Melstrip DP Additive	Tin displacement and deposition are effectively restricted   by adding dry film stripping agents such as sodium hydroxide,   potassium hydroxide, etc.,