Products	Materials	Characteristic
Cleaner-160	Iron   Copper, Copper alloy   Magnesium	General alkaline electrolytic cleaner   Can be used as both anodic and cathodic use
Enbond CA-S	Iron   Copper, Copper alloy	Low temperature alkaline soak cleaner   Can be used as electrolytic

Products	Materials	Characteristic
Actane 70	Aluminum, Titanium   Magnesium	Activator with fluoride   Remove smut on Al alloy
Melpolish FN-71	42 alloy	Chemical polisher without fluoride and hydrogen peroxide for inner   lead of lead flame   Etching rate : 0.9 ~ 1.1㎛/min (42 alloy)
Melpolish FN-72	42 alloy	Chemical polisher for outer lead of lead flame   Remove pressing burr and scratching   Etching rate : 2.5㎛/min (30sec. 45℃)
Melpolish CU-1210	Copper   Copper alloy	Improve corrosion resistance after nickel / gold plating   Etching rate : 1.2㎛/min (copper alloy plate)
Melpolish CU-1220	Copper   Copper alloy	Improve corrosion resistance after nickel / gold plating   Etching rate : 2.7㎛/min (copper alloy plate)
Melpolish CU-61	Copper   Copper alloy	Chemical polisher for reel production   No fluoride, hydrogen peroxide, phosphorus, nitrogen, halogen and   chelating agent in bath   Etching rate : Improve corrosion resistance after nickel / gold plating   Etching rate : 0.9㎛/min (45℃)

Process	Products	Characteristic
Gold plating for connector	Ronovel CS-100	Hard gold plating for high-speed partial plating to the electronic parts   by high-speed plating equipment   Application : Terminal of electric parts                        For flash plating   Properties of Deposit : Purity=99. 7% or more, Hardness=180~190 Hv
	Ronovel CS-200	Hard gold plating for high-speed partial plating to the electronic parts   by high-speed plating equipment   Application : Terminal of electric parts                        For thick plating   Properties of Deposit : Purity=99. 7% or more, Hardness=180~190 Hv
	Auro Glo-PC-171	Bright gold plating for rack plating and barrel plating   Provide high hardness and excellent wear resistance   Application : Rack and barrel plating for connector, terminal   Properties of Deposit : Purity=99. 8% or more, Hardness=130~250 knoop                                        MIL-G·45204-B, TypeⅠorⅡGrade B, C&D.
	Auronal 44BC	Low gold concentration type   Excellent thickness distribution   Application : Rack and barrel plating for connector, terminal   Properties of Deposit : Purity=99. 7% or more, Hardness=120~220 knoop                                        MIL-G·45204-B, TypeⅠorⅡGrade B, C&D.
	Ronovel R	High-speed hard gold plating for connector, PWB   Provide high hardness and excellent wear resistance   Application : High-speed plating for connector, PWB   Properties of Deposit : Purity=99. 7% or more, Hardness=130~200 knoop                                        MIL-G·45204-B, TypeⅠorⅡGrade B, C&D.
	Ronovel C	High-speed hard gold plating for connector, PWB   Provide high hardness and excellent wear resistance   Application : High-speed plating for connector, PWB   Properties of Deposit : Purity=99. 7% or more, Hardness=130~200 knoop                                        MIL-G·45204-B, TypeⅠorⅡGrade B, C&D.
Tin plating for connector	Solderon BT-280	High-speed bright tin plating for wire, hoop plating   Excellent solderability and heat resistance   Bright type
Gold plating for semiconductor	Aurall 292M	Especially suitable for barrel plating to electronic parts   Excellent throwing power that gets uniform deposit to complex shaped parts   Application : Rack plating, Barrel plating for semiconductor parts   Properties of Deposit : Purity=99. 99% , Hardness=70~80 knoop                                        MIL-G·45204-B, TypeⅢ, Grade A.
	Aurovel UP-24	Widely bright electroplating range   Application : Rack plating, Barrel plating for semiconductor parts   Properties of Deposit : Purity=99. 99% , Hardness=70~80 knoop                                        MIL-G·45204-B, Type Ⅲ, Grade A.
	Aurall 364 Strike	Gold strike plating to nickel or nickel alloy
Tin plating for MLCC	Solderon SN-2650S	Electro-Tin plating for electronic devices
	Solderon SN-2670	Electro-Tin plating for electronic devices

Products	Stripping Layer	Based Material	Characteristic
Enstrip S Solution	Nickel, Zinc, Cu,   Cu alloy, Tin, Silver	Iron	Cyanide alkaline type   Stripping rate Ni : 0.5㎛/min, Cu : 1㎛/min
Melstrip CU-3940	Copper	Iron	Ammonium alkaline type   Stripping rate Cu : 0.9㎛/min(25℃), 2.8㎛/min(50℃)
Enstrip NP	Nickel	Iron, Cu,   Cu alloy	Cyanide free alkaline type   Stripping rate Ni : 0.4㎛/min(70℃)
Melstrip N-950	Nickel	Cu, Cu alloy	Sulfuric acid type   Stripping rate Ni : 3.0㎛/min, Cu : 0.1㎛/min
Melstrip TL-3400	Tin, Tin alloy	Cu	Nitric acid type without Fluoride and H2O2   Stripping rate Sn-Pb:8㎛/min, Sn-Ag:3㎛/min, Sn-Bi:5㎛/min                          Sn-Cu:8㎛/min, Copper base:0.2㎛/min
Enstrip TL-105	Tin, Lead   Sn-Pb Solder	Cu	Fluoride acidic type   Stripping rate : 2~3㎛/min
Agrip 940	Silver	Cu, Cu alloy,   Fe-Ni alloy	Hydrogen peroxide type   Stripping rate : 2.5~3㎛/min
Enstrip AU-78M	Gold	Iron, Nickel,   Cu, Cu alloy	Cyanide alkaline type   Stripping rate : 2~4㎛/min