Process	Products	Characteristic
Cu Etching	A-PROCESS-W	Mildly alkaline copper etchant    Etching rate : 5000Å/10sec(Dipping)
	E-PROCESS-WL	Mildly alkaline copper etchant    Etching rate : 6000Å/min(Dipping)
	Melstrip CU-3931	Acidic copper etchant    Etching rate : 7500Å/min(Dipping)
Ti Etching	Melstrip TI-3991	Alkaline titanium etchant    Etching rate : 300 ~ 850Å/min(Dipping)

Process	Products	Characteristic
Degreasing	Melcleaner SC-7001	Degreaser for aluminum pads on silicon wafers
Etching	Melplate E-7121	There is little dissolution of the aluminum electrode
Conditioning	Melplate Conditioner 7230	Conditioner
1st Zincate	Melplate FZ-7350	Zincate process for UBM
Zn stripping	Nitric Acid
2nd Zincate	Melplate FBZ	Zincate process for UBM
Electroless Ni plating	Melplate NI-869	A flat and smooth Ni deposition with good
Immersion Au plating	Melplate AU-7601	Stable solder mounting strength can be obtained
	Melplate AU-7621	Very light erosion into the substrate electroless nickel deposition