(ÁÖ)ÀÌÈ­±³¿ª - IHWA CO.,LTD.
Language : KOREAN Language : ENGLISH
¹ÝµµÃ¼ °ü·Ã¾àǰ HOME > Á¦Ç°Á¤º¸ > ¹ÝµµÃ¼ °ü·Ã¾àǰ
Wafer Bumping¿ë EtchingÁ¦ : MEMS, BUMP, Rewiring Device Á¦Á¶¿¡ À־ÀÇ Seed Layer Etching¿¡ ÀûÇÕ. ƯÈ÷, °¢ Processº° ¼±ÅÃÀûÀ¸·Î ¿øÇÏ´Â ±Ý¼Ó¸¸ EtchingÀÌ °¡´É
UBM (¹«ÀüÇØ Process) : ¹«ÀüÇØµµ±ÝÀ¸·Î Al Electrode Pad¿¡ ¼±ÅÃÀûÀ¸·Î UBM Çü¼º
¹«ÀüÇØ Ni/Pd/Au µµ±ÝÀ¸·Î ÀúStress, ÀúCost, °í½Å·Ú¼º Electrode¸¦ Á¦°ø